LM-79 Moving Detector Goniophotometer (Mirror Type C)
LSG-6000
High Precision Rotation Luminaire Goniophotometer
LSG-1890B
High Precision Rotation Luminaire Goniospectroradiometer
LSG-1890BCCD
Goniophotometer for Automotive and Signal Lamps
LSG-1950
Goniophotometer for Traffic Signal Lamps
LSG-1950S
VAD Fire Alarm Visual Alert Device Goniophotometer
LSG-1930
Compact Goniophotometer
LSG-1200A
LED Goniophotometer
LSG-1100
LEDs and Luminaire Test Solutions
LM-79 and LM-80 Test Solutions
LED Driver Test Solutions
Household Appliances Test Solutions
Mobile and Network Test Solutions
Automotive Electronics Test Solutions
Audio-Video and IT Test Solutions
Cable and Wire Test Solutions
Plugs and Sockets Test Solutions
Power Switch Test Solutions
Transformer Test Solutions
Electric Toys Test Solutions
Energy Meter Test Solutions
Motor-Operated Tool Test Solutions
Select an organization
to browse standards
Abstract With the rapid development of aerospace, rail transit and new‑energy equipment industries, the reliability verification of product mechanical environments puts forward higher requirements for laboratory hardware, data traceability and standard compliance. A CNAS Certified Vibration Test System serves as the core hardware complying with laboratory accreditation criteria. The Electrodynam...
Abstract An Electrodynamic Vibration Generator System adopts the electromagnetic excitation principle to reproduce vibration environments under various practical working conditions, so as to verify the vibration resistance, operational stability and working reliability of components and finished products throughout their life cycle. The complete set of equipment is equipped with a dedicated contro...
Abstract: Salt‑spray corrosion is a major cause of material failure in marine, coastal and industrial atmospheric environments. As core environmental‑simulation equipment for artificial accelerated corrosion simulation, the salt test chamber (salt spray test chamber) can reproduce salt‑containing atmospheric corrosion environments under laboratory conditions and rapidly evaluate the corrosi...
Abstract In the export trade of electrical and electronic products, RoHS hazardous substance control has become a basic compliance threshold for products. Traditional wet‑chemical testing methods feature complicated workflows and long testing cycles, which can hardly satisfy practical demands for high‑volume rapid material inspection in factories. EDXRF RoHS Testing Equipment is built upon ene...
Abstract With the continuous expansion of control scope under EU RoHS 2.0, export‑oriented electrical and electronic enterprises are confronted with stricter requirements for hazardous substance control. Hazardous substance screening for supply‑chain materials has become a core link for product compliance. RoHS Compliance Testing Equipment can detect various restricted substances regulated b...
Abstract In industrial power grids and civil power supply systems, damped oscillatory ring‑wave interferences are generated due to high‑voltage switch switching, transformer transient oscillation, power faults and inductive load switching. Such transient disturbances couple into electrical and electronic equipment through power lines and signal lines, which may easily result in equipment crash...
Abstract In hazardous operation scenarios such as military industry, chemical engineering, oil and gas exploitation, powder materials, flammable‑explosive liquids, electro‑explosive devices and related electronic components tend to accumulate static electricity during production, transportation and storage. Tiny electrostatic sparks may trigger major safety accidents including combustion and e...
Abstract During the production, transportation and assembly of semiconductor chips, charged‑device‑model electrostatic discharge constitutes a major cause of unexpected failures of integrated circuits. Such failures feature strong concealment, ultra‑short pulse duration and high difficulty in failure reproduction. Conventional Human‑Body Model (HBM) and Machine Model (MM) tests cannot full...
Throughout the full workflow of semiconductor device R&D, packaging, manufacturing, transportation and assembly, electrostatic discharge represents a major cause of latent chip failures. Electrostatic pulses can be generated by human contact, automated equipment contact and material friction. Even without visible discharge phenomena, irreversible damage may occur to chip gate oxide layers and ...
English
中文简体
English
Русский
Español
Português
Türkçe
العربية
Deutsch
Polski
Italiano
Français
한국어
ไทย
Tiếng Việt
日本語
