HBM/MM ESD Simulators for IC Testing

The ESD-883D HBM/MM ESD Simulators for IC Testing is a high-precision ESD immunity testing device specially designed by LISUN for semiconductor components (such as chips, diodes, transistors, and IC modules). Its core function is to simulate two common electrostatic discharge models encountered in the production, transportation, and assembly processes of semiconductors: the Human-Body Model (HBM) and the Machine Model (MM). Through standardized high-voltage pulse injection, it evaluates the tolerance limit of semiconductor components to electrostatic shocks, proactively identifies potential faults (e.g., gate breakdown and PN junction damage) caused by static electricity, and provides critical testing basis for the reliability design and factory quality inspection of semiconductor components. Adopting a modular circuit design, the device supports one-click switching between HBM and MM testing modes. It is equipped with a high-precision voltage feedback system, ensuring that the discharge voltage error is ≤ ±3%. Meanwhile, it has a built-in dust-proof and anti-corrosion enclosure, which is suitable for the strict environmental requirements of semiconductor cleanrooms (Class 1000).

The ESD-883D HBM/MM ESD Simulators is equipped with a large-sized Android touchscreen supporting both Chinese and English. It enables presetting of test parameters (e.g., HBM standard levels of 2kV/4kV/8kV) and is compatible with LISUN’s self-developed semiconductor test fixtures (such as TO package fixtures and SMD chip fixtures). The device can be adapted to semiconductor components with different package types, including DIP, SOP, and QFP, eliminating the need for frequent fixture replacement. Whether it is for chip reliability verification in semiconductor design companies, factory quality inspection in packaging plants, or compliance certification in third-party laboratories, this device can provide a stable and accurate testing environment, helping semiconductor products meet electrostatic protection standards in global markets.

Specifications:

Note: ESD-883D can share a host with ESD-CDM Charged Device Mode (CDM) ESD Testing for IC to test HBM, MM and CDM at the same time (LISUN model: ESD-883D/ESD-CDM)

Typical Applications：
1. Semiconductor Design and R&D Field
• Chip Reliability Verification: For MCUs, power management chips, RF chips, and other devices developed by IC design companies, HBM testing (e.g., standard levels of 1kV/2kV/4kV) is conducted to simulate electrostatic discharge when the human body comes into contact with the chip. MM testing (e.g., 0.5kV/1kV) is used to simulate electrostatic discharge when automated equipment (such as chip mounters and probers) contacts the chip. This verifies the electrostatic resistance of the chip’s gate oxide layer and PN junction, optimizes the chip’s electrostatic protection design (e.g., adding ESD protection diodes), and prevents chip failure caused by insufficient electrostatic protection during the R&D phase.
• Electrostatic Susceptibility Testing of New Materials: HBM/MM testing is performed on new semiconductor materials (such as wide-bandgap semiconductor SiC and GaN devices) to determine the electrostatic susceptibility levels (e.g., Class 000, Class 00) of these materials. This provides reliable data support for the application of new materials in high-frequency and high-voltage chips.

2. Semiconductor Packaging and Manufacturing Field
• Post-Packaging Quality Inspection: In semiconductor packaging plants (e.g., after DIP, SOP, and QFP packaging processes), HBM/MM sampling tests are conducted on packaged devices of each batch. By leveraging the fast dual-mode switching function of the ESD-883D, the tests detect whether issues such as poor wire bonding or damaged packaging colloid during the packaging process have led to reduced electrostatic susceptibility of the devices. This ensures that the outgoing devices meet the requirements of the JEDEC JESD22-A114F/A115-A standards.

3. Automotive Electronics Semiconductor Field
• Automotive Chip ESD Testing: For automotive MCUs and sensor chips (such as millimeter-wave radar chips and camera ISP chips), in accordance with the “ESD Susceptibility Testing” requirements specified in AEC-Q100 (Automotive Electronic Component Reliability Standard), HBM 8kV and MM 2kV tests are conducted. These tests simulate electrostatic shocks during automotive assembly processes (e.g., manual connector plugging/unplugging, automated assembly), ensuring the electrostatic resistance reliability of chips in automotive environments and preventing vehicle system malfunctions caused by static electricity (such as instrument panel blackouts and false alarms in autonomous driving signals).
• IGBT Module Testing: HBM/MM tests are performed on the gate driver chips of IGBT modules for new energy vehicles. These tests verify the electrostatic tolerance of the gate circuit, preventing IGBT mis-turn-on or gate breakdown caused by static electricity and ensuring the safe and stable operation of the power system in new energy vehicles.

4. Military and High-Reliability Semiconductor Field
• Military Chip Testing: In accordance with GJB 548B-2020 Method 3015 and MIL-STD-883 Method 3015, rigorous HBM/MM tests (e.g., HBM 8kV, MM 5kV) are conducted on military communication chips, radar chips, and navigation chips. These tests simulate electrostatic scenarios during military product transportation (such as vibration and friction in ammunition boxes) and battlefield use (such as human-body static electricity in dry environments), ensuring the electrostatic resistance performance of chips in extreme environments and safeguarding the operational reliability of military equipment.
• Aerospace Semiconductor Testing: For aerospace semiconductor devices (such as satellite navigation chips and spacecraft power management chips), leveraging the wide temperature range adaptability (0℃~40℃) of the ESD-883D, HBM/MM tests are carried out under simulated spacecraft cabin environments. These tests verify the electrostatic susceptibility of devices in space vacuum and low-temperature environments, preventing spacecraft malfunctions caused by space electrostatic discharge.

5. Third-Party Testing and Certification Field
• Compliance Certification Testing: Third-party testing institutions such as SGS, CQC, and TÜV use the ESD-883D device. In accordance with international standards including IEC 60749-26/27 and JEDEC JESD22-A114F/A115-A, they provide HBM/MM electrostatic susceptibility test reports for semiconductor enterprises. This helps enterprises’ products obtain certifications such as CE (EU), UL (US), and CCC (China), enabling access to global markets.
• Standard Conformity Verification: For the qualification accreditation of semiconductor testing laboratories (e.g., CNAS certification), the ESD-883D can serve as a standard testing device. Through regular calibration (meeting the requirements of ISO 17025), it ensures the traceability of test data, helping laboratories pass qualification audits and gain the capability to issue authoritative test reports.

6. Consumer Electronics Semiconductor Field
• Consumer-Grade Chip Testing: For consumer electronics semiconductor devices such as mobile phone SoCs, Bluetooth headphone chips, and smart home MCUs, HBM tests (2kV~4kV) and MM tests (0.5kV~1kV) are conducted. These tests simulate electrostatic shocks during consumer usage scenarios (e.g., mobile phone charger plugging/unplugging, headphone wearing), ensuring the devices comply with electrostatic protection standards for consumer electronic products and preventing issues like product crashes or battery life degradation caused by static electricity.
• Semiconductor Component Testing: HBM/MM tests are performed on semiconductor components in consumer electronics (such as camera modules and display driver IC components). These tests verify the electrostatic resistance of multiple chips working collaboratively within the components, preventing damage to the entire component due to electrostatic failure of a single chip and reducing the after-sales failure rate of consumer electronic products.

HBM/MM ESD Simulators for IC Testing - Introduction Video