LM-79 Moving Detector Goniophotometer (Mirror Type C)
LSG-6000
High Precision Rotation Luminaire Goniophotometer
LSG-1890B
High Precision Rotation Luminaire Goniospectroradiometer
LSG-1890BCCD
Goniophotometer for Automotive and Signal Lamps
LSG-1950
Goniophotometer for Traffic Signal Lamps
LSG-1950S
VAD Fire Alarm Visual Alert Device Goniophotometer
LSG-1930
Compact Goniophotometer
LSG-1200A
LED Goniophotometer
LSG-1100
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Throughout the full workflow of semiconductor device R&D, packaging, manufacturing, transportation and assembly, electrostatic discharge represents a major cause of latent chip failures. Electrostatic pulses can be generated by human contact, automated equipment contact and material friction. Even without visible discharge phenomena, irreversible damage may occur to chip gate oxide layers and ...
With the continuous iteration of new‑energy and intelligent connected vehicle technologies, the quantity of electronic control units deployed in vehicles keeps increasing. A large number of sensors, domain controllers and on‑board communication modules are densely distributed inside the vehicle. During vehicle operation, motors, ignition systems and various switching devices generate substanti...
Abstract With continuous iteration and upgrading of modern automotive electronic systems, the quantity of on‑board ECUs, sensors and actuators keeps rising, and the scale of vehicle‑wide wire harness circuits expands accordingly. During actual vehicle operation, wire harnesses are exposed to vibration shock, high‑low temperature cycling, insulation aging and abrasion, which easily cause elec...
Abstract Automotive electrical networks are subject to complex electrical disturbances including voltage drop, polarity reversal, high‑frequency ripple and transient pulses. Automotive electronic components such as ECUs and BMS must pass stringent power‑supply immunity verification before vehicle assembly. Conventional unipolar test power supplies cannot support bidirectional energy flow, and ...
Abstract During vehicle operation, loose wiring harness connectors, oxidized terminals, plug insertion and removal, sudden load changes and other working conditions continuously trigger power supply abnormalities such as voltage dips, transient micro-interruptions and short-term power cuts, which easily cause failures including signal loss of vehicle ECUs and sensors, controller crash and incorrec...
Abstract As a universal international standard for electrical load testing of global automotive electronic and electrical components, ISO 16750-2:2023 has updated numerous electrical stress test clauses targeting new energy vehicles and intelligent on-board controllers. Traditional discrete test equipment cannot fully cover all test items of the latest standard, and the consistency and traceabilit...
Abstract When vehicle electrical equipment operates, disconnection of generators or high-power loads will generate load dump pulses, commonly known as load dump interferences in the industry. Such transient high-voltage pulses easily lead to functional failures and chip burnout of ECUs, vehicle-mounted sensors, on-board chargers for new energy vehicles and other equipment. To complete compliant el...
Abstract In the field of EMC pre-compliance testing, anechoic chambers serve as the traditional standard test site, yet their high construction costs and large floor space create substantial barriers for small and medium-sized electronics manufacturers. GTEM Cell Chamber is a new type of EMC test equipment developed based on TEM cells. It adopts an asymmetric tapered rectangular structure to simul...
Abstract CISPR 16 Compliant 3M Anechoic Chamber serves as the core fundamental site for radiated radio disturbance (EMI) certification tests. Its structure, materials and electrical accessories shall strictly comply with CISPR 16‑1‑4 specifications. Anechoic chambers are divided into two categories: semi‑anechoic chambers and fully‑anechoic chambers. Obvious differences exist between the t...
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