Material Epitaxy, Composition and Illumination of LED Chip
Types of Led Chip Material Epitaxy 1.LPE：Liquid Phase Epitaxy GaP/GaP 2.VPE：Vapor Phase Epitaxy GaAsP/GaAs 3.MOVPE：Metal Organic Vapor Phase Epitaxy AlGaInP、GaN 4.SH：GaAlAs/GaAs Single Heterostructure GaAlAs/GaAs 5.DH：GaAlAs/GaAs Double Heterostructure GaAlAs/GaAs 6.DDH：GaAlAs/GaAlAs Double Heterostructure GaAlAs/GaAlAs Composition and Illumination of LED Chip Composition of LED chip: It is mainly composed of arsenic (AS) aluminum (AL) gallium (Ga) indium (IN) [...]
Classification of LED Chips
1. Definition and characteristics of MB chips Definition: Metal Bonding Chip; this chip belongs to the patented product of UEC. Characteristics: (1) It is easy to dissipate heat by using the materials of high heat coefficient, Si is the substrate. Thermal Conductivity: GaAs: 46W/m-K GaP: 77W/m-K Si: 125～150W/m-K Cupper: 300~400W/m-k SiC: 490W/m-K （2）The absorption of the [...]
LED History and Principles of LED Chips
LED History Fifty years ago, people have known about the basic knowledge of the semiconductor materials that can produce the ray o light. LED is the abbreviation of light emitting diode; its basic structure is a piece of electroluminescent semiconductor materials. It is fixed on a shelf with the lead and sealed around with epoxy [...]
Common Quality Problem Analysis and Strategies of LED Chips
1. High direction pressure drop, dark light A: Electrode and luminescent materials are ohmic contacts, but the contact resistance is large, which is mainly caused by the substrate materials’ low concentration or electrode defect. B: Electrode and materials are non-ohmic contacts, which mainly happens to be the extrusion seal or the chip seal and the [...]
