According to the vibration theory of the two kinds of transparent medium interface, a beam of light will be decomposed to p component running parallel to r incident plane and the s component perpendicular to the incident plane. During the process of reflection and refraction, the vibration of the two components p and s is independent of each other. According to Fresnore fraction formula, the photon transmissivity of component p and s is not the same during the refraction process,therefore,we should calculate separately.

According to above model, the photon overflowed from the cone, the light distribution is rotational symmetry. Therefore, as long as we select any flat surface of the optical axis, and calculate the light distribution from 0 to 90 degrees, we can get the light intensity curve of the whole space.

The photon emitted from p-n junction to the resin interface, because of the existence of the reflection angle, the scope of the incidence angle i is among 0-I, but the emergence angle i2 is -901. The specific calculation process is as follows:

(1)Divide the emergence angle i2 into 90 parts according to the proportional of Δi2=i0;

(2) From the refraction formula, we can conduct the incidence angle i that is correspond to every emergence angle;

(3) According to Fresnel photon transmissivity formula, we can respectively work out the photon transmissivity of p,s component that is correspond to every angle.

(4) Take the luminous intensity (photon density) of p-n junction as the unit volume1, and then the output light intensity is

(5) Calculate the relative values WP, Ws of the output light intensity of the angle on the base of angle of departure. Work out their average value w and the relative intensity WP, W, and the congruent relationship of the average value W and angle i2, w we can get the relatively light intensity distribution curve, and compare the average value curve and the cosine value, seen as figure 4. Seen from figure 4, the relatively light intensity average value curve basically corresponds with the cosine distribution.

Figure 4 the relatively light intensity distribution curve under the system of rectangular system

If X,= W *cos i; Y=W*sin i, and y is the ordinate value, x is the abscissa value, we can get the distribution curve between 0-9 under the polar coordinate. Seen from figure 5, if we copy it around, we can get the distribution curve flux from -90-90 degrees.

1 Point light source hypothesis

LED is the chip composed of P type semiconductor and N type semiconductor; they have formed the intermediate layer, the PN junction ( LED Junction Temperature ). When p-n junction offsets, electronics and holes will separately inject into PN junction from N type and P type, and is composite and shine. If p-n junction is the square shiny surface, the area is about 0.7mm2 , but LED columnar section area is about 20 mm, therefore, p-n junction light-emitting area holds 4%, and we can assume p-n junction light emitting to be as one of the pointillists.

2 Total Reflection Core

When the light is sent out to the optically thinner medium from the optically denser medium and will be totally reflected when the incidence angle is larger than the critical angle. We assume to use the GaAs material with the refractive index of 3.9; the outside packaging materials use the epoxy resin with the refractive index of 1.5. i, =22.60 (we have assumed that p-n junction light emitting is a point light source, therefore, only when i. = 22.6, the photon within a cone can overflow the chip. Shown as figure 2, the reflective photon is assumed not to be sent out because of the internal absorption. In addition, the photon reflected by the p-n junction light source on the lower half plane will also be assumed not to be sent out because of the basement and internal absorption.

Figure 2 total reflection schemes of chip/ epoxy resin interface

3 Hemispheric packaging

In order to protect the semiconductor chip, we usually use the transparent medium to fix it, which is called packaging. Packaging usually uses epoxy resin; the packaging shape directly determines the distribution of light output. As shown in figure 30, we assume that p-n junction luminescence is one light point source 0, the thickness of general LED chip is about 0.5 mm2, we can work out the bilge radius of the circular cone r=0.2 mm by calculating the critical angle, but the radius of the packaging hemisphere is2.5mm, the cone size is 0.8% of it, that can be negligible, therefore, we assume that the light is emitted from the p-n junction luminous point 0. If we adopt the top hemisphere packaging as shown in figure 3, the chip is in the center, we can roughly assume that the light emitted from the chip is perpendicular to the air interface of the epoxy resin, and there is no total reflection. The loss of photon spilled is the reflection loss, it is very convenient to calculate.

Figure 3 hemisphere packaging sketch map

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Abstract: Using the Fresnel formula to calculate the distribution curve flux ( Flux Meter ) emitted from LED chip to the packing materials, and the light output efficiency of this interface; then calculating the light efficiency of the packing materials and the air interface so as to get the influence of the Packaging materials refractive index of the simple case shape LED on the light shooting out efficiency.

Keywords: LED; distribution curve flux; efficiency; light shooting efficiency

LED has been recognized as the promising new lighting source in the 21st century. As the fourth generation light source after the filament lamp, fluorescent lamp and high intensity discharge lamp, LED has the extremely bright future with the characteristics such as small power dissipation, long life, small size, low heat and sturdy and durable structure. LED still has the upside potential in available colors, light emitting power and cost performance, which has been widely applied. For example, the application in traffic lights, indicating lamps and large screen display has been increased; however, the luminous efficiency of LED is not high enough. The further improvement of efficiency has been one of the hot topics for the current research.

Based on the refractive index of the packing materials, this paper has adopted the simplified LED structure model, and calculated the light emitting efficiency of each interface by using the Fresnel reflection and refraction formula, so as to get the total output efficiency, namely, the influence of the packing materials reflective index on the light emitting efficiency.

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The application of the second copy power source in the lighting system is one of the important factors to lower the cost and improve the flexibility. The inherent limited power sources such as the transformer, power supply and batteries can contain the protection components, as long as they don’t depend on these components to limit the output of the second type power source.

Non-inherent limited power source has one discrete protection component. According to its definition, when the current and power output arrives at the index value, it will automatically interrupt the input. All kinds of circuit protection components are conductive to provide the safe operation of LED lighting application of the second type power source. Figure 1 indicates the operating principle of the collaborative protection scheme.  It has adopted a MOV on AC input a PolySwitch component on the branch of output circuit, which can help the manufacturers to meet the requirement of the section 35.1 of UL 1310 aiming at the over-load test of the switch and control device.

Figure 1 the collaborative protection scheme of the second type power source

Reset of PPTC components can prevent the damage caused by over current and over temperature fault. MOV over-voltage protection components are conductive to the manufacturers to meet the requirement of all kinds of security mechanism, can provide large current transport and have the energy absorption capability, and can rapidly respond to the over-voltage transient. Compared to most ESD protection components, PESD component capacity is very low, about 0.25, and has the most common form factor in the electronics industry.

PolyZen components not only has provided the simplification of the traditional clamping diode, but has also avoided the large demands of heat sink. This kind of single component scheme can provide the protection for the damage caused by the misuse of the power source, and has the protection ability of transient suppression and reverse biased voltage to prevent the damage caused by over current. The application of these components in the collaborative protection scheme can help the designer decrease the component number, provide the safe and reliable products to meet the requirement of the regulatory body, also can reduce the warranty and maintenance costs.

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LED is driven by the constant current, its forward voltage is between 2~4.5 volt, and is related to the color and current. The old design limited LED driving current depending on the simple resistor, but the design of led circuit based on the provision of the typical downstream pressure drop by the manufacturer may cause the over-heating of LED driving device. When the forward voltage of LED drops to the level that is far lower than the typical rated value, there may appear such kind of situation. In such event, the rise of the voltage that goes through LED driving device may lead to the high dissipation of the total power; therefore, it may cause the adverse effect to the performance or life.

Currently, most LED applications use power conversion and control assembly to connect all kinds of power source, such as the exchange wire, solar-cell panel or battery, in order to control the power dissipation of LED driving device. These connectors are protected to avoid the damage because of over current and over heating by using the polymer positive temperature coefficient (PPTC) component, which has the reset ability. The connection in series of power input and a PolySwith component can prevent the damage caused by the short circuit, current overload or the user error operating. Moreover, the metal oxide variable resistance on the input end is also helpful to the over voltage protection for the LED modules.

PolySwitch LVR can also be placed behind MOV. Many equipment manufacturers chose the PolySwitch package assembly with the ability to protect the circuit and reset the upstream fault security protection. In this example,R1 is the steady resistance combined with the protection circuit. LED driving device is easy to be damaged by DC voltage and incorrect polarity, the charged port is also easy to be damaged by over pressure transient, including the electrostatic discharge (ESD) pulse. Figure 1 indicates the typical circuit protection design specially for LED driving device and bulb array, the PolyZen components in the input driving device has not only provided the simplification of the traditional champing diode for the designers, but also avoids the needs for the large amount of cooling fins. This component is helpful to the single, small package of transient suppression, reverse bias protection and over current protection.

PolySwitch components in the driving output is conductive to prevent the damage because of harmful short circuit or other abnormal load, in order to make full use of the function of PolySwitch components, it can be connected to the metal core circuit board or LED cooling fin. In addition, PESD components placed together with LED can also protect the electrostatic discharge.

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